In September 2024, just a day before Semicon Taiwan began, Hervé Stämpfli delivered a speech during the session titled “Innovations of Advanced System Integration in HPC/AI Era” at the Heterogeneous Integration Global Summit. This year’s annual semiconductor event was themed “Breaking Limits: Powering the AI Era.”
The forum was chaired by two senior executives from TSMC. Sponsored by HEIDENHAIN, it marked the first time the HEIDENHAIN Corporate Group participated in such a forum. Hervé’s presentation, “Designing to Decrease TCO: Solutions to Hybrid Bonding Challenges,” aimed to inform end-users and Machine Equipment Manufacturers about the solutions available from HEIDENHAIN Corporate Group to realize the 2028 Hybrid Bonding roadmap.
The presentation covered various topics, including metrology concepts, machine architecture, system design, and the performance capabilities of current and upcoming ETEL Motion System solutions, particularly the upcoming maglev product, HEXAMAG.
The talk attracted over 300 attendees, with many questions raised publicly, indicating strong interest. During the break session, representatives from more than 15 companies sought further details about the solutions. Additionally, numerous individuals visited the booth over the following days.
It can be said that the semiconductor industry is now well aware of ETEL’s capabilities in addressing upcoming Hybrid Bonding challenges.
Unveiling new products
At the HEIDENHAIN booth, in Semicon TAIWAN, ETEL introduced two new system products this year:
RTMC: A new rotary table for testing handlers and die sorters, offering similar performance to the historical RTMBi product at two-thirds of the price. This product is expected to secure ETEL’s position in this competitive market for the next five years and enable competition with well-known rivals. Testing handler manufacturer showed significant interest, discussing the full solution ETEL offers for the turret handler market for over an hour.
QUIET POD: Introduced publicly for the first time, this active isolation solution is designed for applications in both front-end and back-end semiconductor areas. It opens up new applications for ETEL in Advanced Packaging, where accuracy requirements necessitate the suppression of surrounding vibrations. Many customers and prospects visited the booth to learn more about the product design and capabilities, indicating promising future prospects.
