Wafer dicing/scribing
Dicing is primarily about maintaining the integrity and functionality of the individualised components. In addition, chipping, cracks or other deformations of the sensitive chip structures should be avoided.
As the constant pressure to produce more with fewer resources continues and the features continue to shrink, the tolerances and margins for dicing are also being reduced to a minimum. The direct result is that dicing lines must be more precise and accurate than ever before, presenting a challenge to motion system manufacturers.
ETEL provides motion systems with minimal inherent inaccuracies, complemented by metrology concepts and mapping technologies, to elevate dynamic straightness to a new level.
Motion systems
- METIS: For maximal dynamic straightness
- QUIET: To reduce vibration during change of direction
Motion control
- AccurET: Mapping functions with increased position accuracy allowing optics fields of view optimization and reduced signal to noise ratio for a better position stability.
- ACCURET+: Our new generation of electronics with even higher SNR and many new features
Do not hesitate to contact us to find out more about ETEL’s innovative and precise solutions.