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Gantry platforms

TELICA is a cutting-edge multi-axes platform designed specifically for semiconductor back-end applications, offering precise motion along four degrees of freedom: X, Y, Z, and Rz. With its innovative dual gantry architecture, TELICA meets the demanding requirements of advanced die bonding processes.

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Characteristics

  • Dual gantry architecture: Provides precise motion along four degrees of freedom.
  • High placement accuracy: Achieves ±1 µm global placement accuracy and ±350 nm local accuracy.
  • Flexible configurations: Available with one or two gantry beams for different package types.
  • Advanced metrology approach: Reduces Abbé errors and relative positioning mismatch.
  • Water-cooled ironcore motors: Enable extreme duty cycles for demanding applications.
  • AccurET controllers: Offer advanced control features for optimized performance.